The cutting machine is used for high-precision cutting of brittle materials such as third-generation semiconductor silicon carbide, gallium nitride, ceramics, sapphire, glass, etc.

Product series:

PHS1210

Application fields:

Chip packaging testing

Features:

High precision cutting equipment applied to brittle materials such as silicon carbide, gallium nitride, ceramics, sapphire, glass, etc

Adopting a dry process with zero cutting loss, achieving high productivity

Technical Indicators:

Production product size: 50mm-300mm

Production product thickness: Max.3mm

Processing speed: Max 300mm/s

Processing accuracy:+/-10um