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Key equipment
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Chip automatic loading and unloading machine
Chip loading and unloading machines are applied in the field of chip packaging and testing, especially in the area of chip aging testing. They are suitable for various types of chip usage requirements and have strong compatibility.
Product series:
PPA1210
Application fields:
semiconductor packaging
Features:
This device is a fully automatic IC upper and lower burn in board removal mechanism, which avoids the risk of IC damage caused by vibration and misplacement of BIB or TRAY during manual removal, making the entire chip testing process efficient and accurate
Technical Indicators:
Scope of application: BGA/FBGA/EMC/EMCP/ePOP/QFP/CSP/TSOP, etc. Applicable product sizes: 3X3~44X44mm
