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Zip Code: 14100
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Key equipment
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Chip laser marking equipment
Applied in the field of semiconductor packaging, the highly integrated high-precision visual inspection technology and deep learning technology, combined with the integrated design of chip laser marking and appearance inspection, make the inspection more accurate while significantly improving efficiency and product pass rate.
Application fields:
semiconductor packaging
Features:
Adapt to the appearance laser engraving of TRAY packaging integrated circuit products
Final appearance inspection, including Top Vision/Bottom 2D&3D Vision
Technical Indicators:
Scope of application: Packaging forms such as BGA/FBGA/EMC/EMCP/ePOP/UFS/QFN/SOP/LGA/QFP/CSP/TSOP, etc;
Applicable product size: 3X3~44X44mm
Product TRAY Disk: JEDEC Standard TRAY
UPH:MAX.54k
Accuracy:+/-5um
