High precision intelligent online solidification machine and control system, used for binding chips, is a semiconductor packaging equipment for fixing crystals. It can operate independently and fully automatically, with obvious advantages such as high flexibility and precision. It can process multiple substrates and achieve ultra-high speed eutectic.

Product series:

JC100

JC400

Application fields:

semiconductor packaging

Features:

Applied to digital, dot matrix, high-power, COB, SMD and other scenarios

High speed solidification (180ms/piece, with an hourly output of 20K) and precise automation equipment provide effective guarantees for enterprises to improve production efficiency and reduce costs, thereby effectively enhancing their competitiveness

Technical Indicators:

Detection accuracy less than 0.01mm

The eutectic accuracy of the whole machine is less than 0.05mm

Visual positioning accuracy less than 0.01mm

Accuracy greater than 90%

Establishing a deep learning based model library with more than 10 models

PRS module efficiency increased by 50%

Repetition accuracy: less than 0.01mm

The customer feedback for the solid crystal machine mass-produced by Zhongdian Pengcheng is excellent, and the main technical indicators are compared in the following table: