Shenzhen Chengye Precision Technology Co., Ltd has obtained a patent for "OCA bonding equipment", with authorized publication number CN118951682B and a publication date of December 2024.

The present invention relates to the technical field of bonding equipment, specifically OCA bonding equipment, comprising: a bonding machine body, wherein the top of the bonding machine body is provided with a control panel, two instrument panels, and two control buttons, and the two instrument panels and two control buttons are located on both sides of the control panel. By using pressure sensors in conjunction with the first motor for driving, it is possible to clamp molds of different diameters, facilitating OCA bonding of electronic devices of different sizes, improving applicability, quickly fixing molds, ensuring the stability of electronic devices during the bonding process, and improving the clamping efficiency of molds, further improving the OCA bonding efficiency of electronic devices. By controlling the extension and shortening of the air pump, the rotation control of the second transmission shaft can be quickly achieved. After first clamping and fixing the two side walls of the mold, it is possible to continue clamping the front and rear sides of the mold, which is beneficial for clamping and fixing different molds.