FEATURES:

◆ Manual cover /manual and automatic, precise positioning and easy operation;

◆ Use imported gold-plated probes and anti-static materials (Torlon, PEI, PPS, PEEK);

◆ The pressure plate automatically adjusts the pressure on the IC to ensure uniform pressure. The probe has strong adaptive ability and can accurately contact ICs with residual balls and uneven solder balls;

◆ Use Pogopin module for connection. Pogopin module can adopt probe or spring structure;

◆ High test accuracy, good stability, simple operation and convenient maintenance.

PARAMETERS:

◆ The test life can reach 100K times ~ 1000K times; 

◆ The test spacing can reach 0.2MM , 0.35MM , 0.4MM , 0.5MM , 0.6MM;

◆ Processing accuracy ≤ 0.01 mm.

APPLICATION:

3C industry (mobile phones, wearables, tablets, notebooks) cameras or displays come with Connect testing or lighting imaging.