FUNCTION:

An automatic plane-mirror/grain AOI sorting device with high speed, high precision and high stability, which is used to pick the sliced wafer/wafer-like product fixed on the blue film for AOI inspection.

PARAMETERS:

◆ Device compatibility: Compatible with 4~12 inch products

◆ UPH: Over 2000-6000PCS (different configurations)

◆ Detection position: product front, bottom, side defect detection;

◆ Detection content: size, edge breakage, damage, scratches, dirt, cracks and other surface defects

◆ Connect with MES system to realize automatic interaction of materials, process parameters, machine status information, etc.

APPLICATION:

After cutting, it is fixed on the blue film 4-12 inch wafer, flat mirror, LED and other wafer processing products.